DIE BONDER
Micronnect delivers West·Bond bonders that are specific for epoxy and eutectic die bonding. Important for the machine choice is the handling of the dice with: vacuum pick-up tool, die-collet, or tweezers.
We supply:
· Epoxy diebonders.
· Eutectic die bonders for the use preform.
· Eutectic die bonders for die bonding without preforms.
· Tweezer machine for epoxy and eutectic die bonding.
· "Beam-lead" bonder.
All of our die bonders are manual, though all bonding processes are machine controlled. The micromanipulator input is blocked during the die bonding processes.
We supply:
· Epoxy diebonders.
· Eutectic die bonders for the use preform.
· Eutectic die bonders for die bonding without preforms.
· Tweezer machine for epoxy and eutectic die bonding.
· "Beam-lead" bonder.
All of our die bonders are manual, though all bonding processes are machine controlled. The micromanipulator input is blocked during the die bonding processes.
- equipment
- fine-wire bonder
- die-bonder
- flipchip bonder
- multifunctional tester
- fine-wire pull tester
- scriber
- consumables
- wire and ribbon
- metal stampings
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- Tel: +31-40 294 02 65