Micronnect delivers West·Bond bonders that are specific for epoxy and eutectic die bonding. Important for the machine choice is the handling of the dice with: vacuum pick-up tool, die-collet, or tweezers.

We supply:
· Epoxy diebonders.
· Eutectic die bonders for the use preform.
· Eutectic die bonders for die bonding without preforms.
· Tweezer machine for epoxy and eutectic die bonding.
· "Beam-lead" bonder.

All of our die bonders are manual, though all bonding processes are machine controlled. The micromanipulator input is blocked during the die bonding processes.