FINE-WIRE BONDER

Micronnect delivers West·Bond thin-wire wedge bonders, ball bonders, insulated wire bonders, as well as convertible machines that do thin-wire wedge, deep access, ball bonding, and stud bumping by changing only the wire clamp (no bond head need be changed). All West·Bond wedge bonders include an angled-feed wire clamp and a deep-access wire clamp.

We supply the following machine types:
· Manual machines
· Z-motorized machines
· Semi-automatic machines
· Automatic machines

West·Bond machines offer deepest access by the overhead wire clamp, and tightest tail control for standard feed by the position of the wire clamp at the smallest distance to the wedge tool.
For all machines, bonding processes are machine controlled, during which the micromanipulator is blocked.