FLIPCHIP BONDER

The JFP die and flipchip bonder accurately places components using direct vision; after alignment the component can be placed without any additional horizontal motion. This direct vision method excludes any influence of horizontal motion system and of the camera system on the placement accuracy when die bonding and flipchip bonding. A machine software supported calibration procedure offers (one-time) calibration of the tool and in case of flipchip bonding of both alignment cameras.

The machine offers various connection methods: Epoxy, eutectic, (horizontal) ultrasonic. Epoxy can be dispensed and be stamped.

Best accuracy after placement is 3 µm. It is important to realize that such accuracy is influenced by various factors that do not relate to the machine motion, alignment camera and calibration capabilities, for example: thermal expansion during eutectic bonding; Epoxy shrinkage; flatness of the surface from which dice are picked up (the co-planarity can be adjusted); etc.