WIRE AND RIBBON
Micronnect is official distributor for Coining wires and ribbons.
The wire type is one of the decisive factors for the quality of a wire bond.
Micronnect provides the most wire types used for bonding:
· Aluminum standard wedge bonding wire
· Aluminum wire for very fragile substrates
· Copper Bonding wire
· Gold wire for wedge bonding
· Gold wire for ball bonding
· Gold wire for stud bumps
· Gold ribbon
· Aluminum ribbon
· Platinum wire
· Silver wire
Contact us if you wish other wires or ribbon.
The wire type is one of the decisive factors for the quality of a wire bond.
Micronnect provides the most wire types used for bonding:
· Aluminum standard wedge bonding wire
· Aluminum wire for very fragile substrates
· Copper Bonding wire
· Gold wire for wedge bonding
· Gold wire for ball bonding
· Gold wire for stud bumps
· Gold ribbon
· Aluminum ribbon
· Platinum wire
· Silver wire
Contact us if you wish other wires or ribbon.
- equipment
- fine-wire bonder
- die-bonder
- flipchip bonder
- multifunctional tester
- fine-wire pull tester
- scriber
- consumables
- wire and ribbon
- metal stampings
- Search a product in our catalogue:No results found? Just mail us!
- ASK HERE FOR AN OFFER
- Tel: +31-40 294 02 65