Skip to main content

Bonding capillaries

Micronnect is official distributor SPT capillaries and unplugging tools.

Finding the right model between all types is your real challenge were Micronnect has all expertise to advice you. You will find part of that experience in all our quotations in the extensive technical information for each specific capillary. This procedure reduces the risk ordering wrong capillaries.

We invite you to contact us if you wish more specific information on any tool aspect of your application prior to a quotation or thereafter.

Micronnect supplies the next capillaries:
• Standard ball bonding capillaries
• Capillaries for fine pitch bonding
• Capillaries for stud bumping
• Capillaries for special applications
• Unplugging tools

Please provide us the following information:
• Type of wire bonding machine used.
• Size and alloy of wire.
• Your application sizing (pad size, pitch).

50µm pitch capillary

Ball bonds made at 35µm pitch with ultra-fine-pitch capillary

Stitch bonds made with a 35µm ultra-fine-pitch capillary