• Manual die bonder.
• Beam-lead bonding, leads are bonded ultrasonically.
• Gantry style base allows for large products, smallest footprint.
• All active parts in the top part of the machine.
• Standard height-adjustable platform with co-planarity control.
• Optional large-area height-adjustable platform 500 mm x 500 mm.
• No parallax error front/back and left/right by micromanipulator control.
• Pure vertical Z-motion allows bonding a product with large difference in bond pad elevation.
• Dual head; one beam-lead pick and place one transducer to weld the leads.
• Pick-up tool die rotation.
• Optional shielding gas control.
• Ultrasonic welding of the leads.
• Radiant tool heater.

Experience unlimited deep reach access to remote bond targets on large packages through the throatless chassis and micromanipulator designs. In this configuration, all machine components, circuitry enclosures are strategically positioned above the horizontal bond plane, removing any limitations related to package size or shape. Manual “E” Series models, catering to microwave, semiconductor, R.F. hybrid production

The model 7374E is specifically designed for ultrasonic bonding, focusing on heating the tab leads of beam lead diodes. The right head is employed for the pick-up of tabbed die with the provision for rotation during placement.