Precision Semi‑Automatic Scribing & Breaking
The Scriber S100 is a compact, semi‑automatic system for precise scribing and breaking of fragile semiconductor materials such as GaAs, InP, and silicon wafers. 
It delivers clean, stress‑free break surfaces and high repeatability, ideal for laser bars, diodes, and small die segmentation.


Key Features
• High‑precision scribing head with adjustable 10–80 g force
• Diamond tool with angle and rotation adjustment
• Motorized X/Y stages with 0.23 µm resolution
• Wafer handling for 4” chucks, tape and dry mode
• UHD vision system with 22” monitor and 10× electronic zoom
• Manual or automatic breaking with rubber pusher + cutter blade
• Intuitive 7” touchscreen for all process parameters


Applications
• Laser bar → laser diode segmentation
• III‑V semiconductor processing
• Wafer sub‑dicing
• Opto‑electronic component manufacturing

Why Choose the S100?
• Clean, controlled scribe and break
• Stable, vibration‑free design
• Minimal operator training
• Excellent for delicate and brittle materials<