Dual head convertible manual diebonder for epoxy and eutectic die bonding, with and without preforms.

• Programmable by 7″ capacitive touch screen.
• Programmable force.
• Manual die bonder for epoxy and eutectic die bonding.
• Dual head; One dispensing or preform pick and place one die pick-up.
• Programmable scrubbing with final position left, right, or center of scrubbing motion.
• Pick-up tool with die rotation and radiant tool heater.
• Standard shielding gas control.
• Gantry style base allows for largest products on smallest footprint.
• All active parts in the top of the machine.
• Standard height-adjustable platform with co-planarity control.
• No parallax error front/back and left/right by micromanipulator control.
• Pure vertical Z-motion allows bonding a product with large difference in bond pad elevation.

GANTRY MODEL: With the same unlimited deep reach access to remote bond targets on large packages, the West Bond system takes a step further with a 7” capacitive touch screen and programmable force control utilizing the Cortex M7 microcontroller. This machine proves to be an excellent addition to applications in the microwave, semiconductor, RF, or Hybrid field.

The CONVERTIBLE model 73KF features interchangeable tool head assemblies for bonding through epoxy or eutectic methods. Standard elements include pick-up tool rotation and a radiant heater. All programmed bond variables for each tool head assembly are securely stored in memory and easily retrieved upon conversion.