Wire bonding work holders are essential tools used in the semiconductor and electronics industry for securing and stabilizing the components during the wire bonding process. These holders play a crucial role in ensuring precise and accurate bonding of wires to semiconductor devices. Designed to securely grip and support the delicate components, wire bonding work holders contribute to the efficiency and reliability of the wire bonding assembly process. There are numerous types of work holders and Micronnect is specialized to recommend the useful type for your operation.

We herewith show the most general types of non-heated (wedge- or deep access wire bonding with Aluminum wire or ribbon) and heated work holders (wedge- deep access or ball bonding of Gold wire or ribbon). To facilitate a heated work holder a heat controller (K~1201D) is required.

Example for non-heated work holder:
3600.002: Basic non-rotating work holder for substrates up to 2,54mm. x 2,54mm.
Work piece is held by mechanical clamp, with double rail adjustable backstops.

Examples for heated work holders:
45: for substrates up to 2,54mm. x 2,54mm. Work piece is held by mechanical clamp, with an adjustable backstop. Feature: 200W Round Grip, Maximum temperature 175⁰C.

45G: Heated work holder: for substrates from 9,5mm. up to 50,8mm. Work piece is held by mechanical clamp, with an adjustable backstop.
Temperature controller 600W (K~1201D 230): Required to operate heated work holders. PID-control with recommended settings for all work holders. For control accuracy, calibration required for each specific product to be wire bonded.