The MPT is a precision wire pull tester designed for evaluating wire bond strength and bond quality in microelectronics applications. Suitable for both destructive and non-destructive testing, the MPT provides accurate and repeatable pull force measurements for fine wire diameters ranging from 15 µm to 100 µm. Its compact design, intuitive operation, and robust mechanical construction make it an ideal solution for laboratories, quality control departments, and semiconductor manufacturing environments.
Key Features
• Precision wire pull testing system for microelectronic assemblies
• Supports destructive and non-destructive pull testing
• Accurate dial gauge force measurement
• Pull test ranges from 1 g up to 250 g
• Quick vertical positioning system with fine adjustment control
• Suitable for wire diameters from 15 µm to 100 µm
• Hook sizes available for various wire applications
• Vacuum workholder for secure sample positioning
• Manually adjustable platform and work stage
• Compact tabletop design requiring minimal workspace
• Simple and robust mechanical construction
• Easy operation with minimal training required
Applications
• Wire bond quality control and inspection
• Semiconductor device manufacturing
• Microelectronics assembly verification
• Failure analysis and reliability testing
• Process validation and qualification
• Research and development laboratories
• Prototype and pilot production environments
• Incoming and outgoing product quality assurance
Why Choose the MPT?
• Reliable and repeatable bond strength measurements
• Suitable for both production and laboratory environments
• Enables fast verification of wire bond quality
• Supports delicate microelectronic devices and assemblies
• Cost-effective alternative to fully automated pull testing systems
• Flexible workholding and stage configurations available
• Compact footprint for easy integration into existing workspaces
• Designed for accurate testing of fine bond wires
• Durable mechanical design with low maintenance requirements
• Essential quality assurance tool for semiconductor packaging and microelectronics assembly
