Single point bonder for bonding insulated wire without stripping the insulation prior to the welding process. The system is suited for insulated wires with diameters ranging 18 µm to 50 µm. Flexible machine in production and laboratory.

• Manual bonder for bonding insulated wires preventing de-insulation prior to the bonding process.
• Gantry style base allows for large products.
• All active parts in the top part of the machine.
• Smallest footprint, largest products.
• Standard fixed platform 279 mm x 279 mm.
• Optional height-adjustable platform 279 mm x 279 mm.
• No parallax error front/back and left/right by micromanipulator control.
• Pure vertical Z-motion allows bonding a product with large difference in bond pad elevation.

West Bond’s Model 7440E Series presents dedicated ultrasonic wire bonders designed for interconnecting insulated, gold-plated copper wire to thin film sliders or Flex-Circuits.

The machine adeptly bond insulated wires with diameters ranging from 18 µm to 50 µm. directly to thin film gold without the need for stripping off the insulation. This process is achieved using a specially designed wedge tool that applies programmed ultrasonic energy, force time to soften and disperse the insulation. Subsequently, it bonds the exposed wire to the metallization on the workpiece.

The patented single lever X-Y-Z micromanipulator enables operators to engage a free-standing end of a twisted wire pair in mid-air and guide it to touch down on the workpiece at the bond target, all while under microscope observation. The machine senses touchdown, initiating the bond program.

An integral part of this serie is the unique three-axis micromanipulator. The entire mechanism is positioned above the work plane, eliminating any restrictions on the size of the workpiece. Each of the X, Y Z axes is straight-line and purely orthogonal each can be pneumatically braked upon signal. In this application, all axes are braked during the ultrasonic bond time to enhance operator control.