Semi-automatic wafer scriber/breaker for optical chips.
• Motorized XYZ, single cut or automated steps.
• Programmable touch-down control.
• High precision.
• Laser Clean facet.
• Up to 4’’ Wafer.

The JFP Microtechnic S100 motorized stage scriber scribes silicon and other breakable materials, such as glass and ceramic substrates. After joy-stick alignment, the machine scribes the whole wafer automatically in one direction. After scribing, products need to be single broken manually.

The JFP motorized scriber-breaker S100 scribes and breaks along crystal planes, such as for semiconductor lasers. The machine can as well be used to scribe and break other breakable materials, such as silicon, glass and ceramic substrates. After joy-stick alignment, the machine scribes the wafer manually controlled or by automatic step-and-repeat in one direction, either over short length scribe lines to break along crystal planes, or over the whole wafer. In a second step, a stressed polyester foil is deposited on top of the crystal with aid of a manual slider mechanism. In a third step, the crystal is broken machine controlled in bars along crystal planes (starting with a short scribe line), or along the long scribe lines when these reach over the whole wafer surface. The polyester foil on top of the crystals is displaced after each breaking line to carry the broken particles out of the breaking zone for the next breaking line. Components are scribed and broken in the second direction into the final shape bar by bar, using a similar procedure. The vibration free stand isolates both machines from external shocks.