The MS Manual Scriber
The Manual Scriber MS is a high-precision manual scribing system designed for wafer dicing preparation, substrate separation, and precision scribe line applications. Equipped with a true vertical vision-alignment system, high-resolution optics, and micrometric positioning controls, the MS provides exceptionally accurate scribing of glass, ceramic, silicon wafers, and other delicate materials. Its robust mechanical design, user-friendly operation, and reliable precision make it an ideal solution for laboratories, prototype production, and low-volume manufacturing environments.
Key Features
• High-precision manual scribing system
• True vertical vision-alignment technology eliminating parallax errors
• Integrated 5 MP Ultra-HD camera with digital zoom
• Adjustable digital crosshair alignment system
• Micrometric X-axis positioning for accurate scribe placement
• Diamond scribing head with true vertical motion
• Adjustable scribing force from 5 g to 150 g
• Toe and heel cut angle capability
• Scribe lengths from 0 mm to 200 mm
• Vacuum substrate holding system
• Compatible with substrates up to 200 mm
• Compact tabletop design with large 200 mm throat depth
Applications
• Wafer scribing and dicing preparation
• Silicon wafer processing
• Glass and ceramic substrate separation
• Semiconductor prototype development
• MEMS device manufacturing
• Electronics and microelectronics packaging
• Dot and short-line marking applications
• Research and development laboratories
• Small-scale production and pilot manufacturing
Why Choose the JFP Manual Scriber MS?
• Exceptional scribing accuracy with vision-assisted alignment
• True vertical optical system prevents positioning errors
• Easy to operate with minimal training required
• Robust and reliable mechanical construction
• Accurate line positioning down to critical substrate features
• Flexible adjustment of force, position, and scribe length
• Suitable for a wide range of materials including glass, ceramic, and silicon
• Compact footprint ideal for laboratories and cleanroom environments
• No compressed air required for operation
• Cost-effective solution for precision scribing and wafer separation processes
