The S200 Diamond Scriber is a high-precision semi-automatic scribing system designed for wafer singulation, substrate separation, and advanced material processing. Equipped with programmable scribing parameters, motorized positioning, vacuum wafer handling, and a high-definition vision system, the S200 delivers outstanding accuracy, repeatability, and ease of use. Its robust vibration-free construction and intuitive control interface make it an ideal solution for research laboratories, prototyping facilities, and low-volume production environments.
Key Features
• Semi-automatic diamond scribing system for precise wafer singulation
• Adjustable scribing force from 10 g to 300 g
• Diamond scribing head with adjustable angle and rotation
• Programmable scribe length and repeat scribing functions
• Motorized wafer rotation with programmable positioning
• Vacuum substrate holding system for enhanced stability
• Supports wafers and substrates from 2″ up to 8″
• High-definition CCD camera with electronic crosshair targeting
• LED illumination with vertical and oblique lighting options
• Micron-level positioning resolution with ±5 µm accuracy
• Touchscreen interface with programmable process parameters
• Optional process inspection camera system
Applications
• Semiconductor wafer singulation
• Silicon wafer processing
• LED wafer scribing
• Sapphire substrate scribing
• Thin glass and borosilicate glass processing
• Alumina substrate separation
• MEMS device manufacturing
• Microelectronics packaging
• Research and development laboratories
• Pilot production and small-scale manufacturing
Why Choose the JFP S200 Diamond Scriber?
• Highly accurate and repeatable scribing performance
• Programmable process parameters for maximum flexibility
• Advanced video targeting system eliminates alignment errors
• Robust vibration-free design for stable operation
• Suitable for a wide variety of wafer and substrate materials
• Fast setup with minimal operator training required
• Excellent visibility through the integrated HD vision system
• Vacuum workholding ensures secure substrate positioning
• Ideal for both development work and production applications
