The JFP WB200-e is a versatile semi-automatic wire bonder designed for R&D, prototyping, small-scale production, and advanced microelectronics applications. Supporting ball, wedge, bump, and ribbon bonding, the WB200-e combines high precision, ease of use, and exceptional flexibility. Its vibration-free design, powerful video microscope system, and advanced bonding modes enable reliable bonding results with minimal operator training.

Key Features
• Supports ball, wedge, bump, and ribbon bonding
• Semi-automatic and manual bonding modes
• Optional upgrade to fully automatic bond mode
• High-precision motorized X/Y stage with 0.23 µm resolution
• True vertical motorized Z-axis bond head
• Powerful video microscope with zoom and focus capabilities
• Auto-Bond function for automatic first and second bond placement
• Multi-height loop programming and fine-pitch wire bonding
• Touchscreen interface with unlimited program storage
• Compatible with heated workholders up to 250°C

Applications
• Research and development laboratories
• Microelectronics packaging and prototyping
• Semiconductor and photonics assembly
• Fine-pitch wire bonding applications
• Limited-access and deep-cavity bonding
• Ball, wedge, ribbon, and bump bonding processes

Why Choose the WB200-e?
• Minimal operator training required
• Vibration-free platform for maximum bonding accuracy
• Flexible system suitable for multiple bonding technologies
• Easy transition from manual to semi-automatic operation
• High-repeatability bonding performance
• Powerful vision system for precise bond placement
• Ideal for prototype development and low-volume production
• Reliable French engineering with a proven industry reputation