The JFP WB100-e is a versatile semi-automatic wire bonder designed for R&D laboratories, prototyping, and small-scale production. Combining motorized Z-axis control, Step Back Y functionality, and advanced bonding parameter management, the WB100-e delivers exceptional flexibility, accuracy, and ease of operation. Its ergonomic design and powerful bonding capabilities make it an ideal solution for both experienced operators and users requiring minimal training.

Key Features
• Semi-automatic wire bonding system for R&D and prototype production
• Supports wedge and ball bonding applications
• Motorized Z-axis bond head with 40 mm travel
• Step Back Y functionality for improved process control
• Optional manual Z mode for repair and development work
• Advanced loop profile programming capabilities
• Touchscreen interface with graphic display
• Automatic bond height detection
• Unlimited bond recipe storage for ball and wedge bonding
• Ergonomic flat-bench tabletop design

Applications
• Semiconductor research and development
• Prototype device assembly
• Hybrid circuit packaging
• Sensor and MEMS packaging
• Small-scale production environments
• Educational and laboratory applications
• Wedge and ball wire bonding processes

Why Choose the WB100-e?
• Easy setup and operator-friendly operation
• Minimal training required for productive use
• High Z-resolution for fine and sensitive wire bonding tasks
• Flexible configuration with multiple optional upgrades
• Reliable and repeatable bonding performance
• Compact design for laboratory and cleanroom environments
• Excellent accessibility for process development and repair work
• Designed to meet modern worldwide laboratory requirements