The PP-One is a fully automated micro-placement and epoxy die bonding system designed for high-accuracy handling of semiconductor devices, laser diodes, sensors, and miniature electronic components. Combining advanced vision alignment, programmable dispensing, and automated pick-and-place functionality, the PP-One offers exceptional placement precision, repeatability, and process flexibility. Its robust mechanical design and user-friendly software make it an ideal solution for R&D, prototyping, and low-volume production environments.

Key Features
• Fully automated pick-and-place and die bonding platform
• Designed for semiconductor, sensor, and microelectronic assembly
• Dual-head configuration for simultaneous placement and dispensing operations
• High-resolution dual 5 MP UHD vision alignment cameras
• Programmable digital crosshair and image overlay system
• Automatic epoxy dispensing with programmable patterns
• Step-and-repeat functionality for automated production processes
• Compatible with wafer ejector systems, gel packs, waffle packs, and trays
• Vacuum pick-up system with adjustable placement force
• Motorized X-Y positioning system with micron-level repeatability
• Customizable tooling and workholders for specific applications
• Intuitive software with live process monitoring and alignment assistance

Applications
• Die attach and epoxy die bonding
• Semiconductor device assembly
• Laser diode packaging
• MEMS and sensor assembly
• Microelectronic packaging
• Photonics and optoelectronic device assembly
• Automated component sorting and placement
• Prototype development and pilot production
• Precision dispensing applications
• Characterization and test handling processes

Why Choose the PP-One?
• Fully automated process reduces operator workload and improves consistency
• High-accuracy placement of delicate and miniature components
• Integrated vision system ensures reliable alignment and positioning
• Flexible handling of wafers, gel packs, waffle packs, and customized carriers
• Advanced dispensing functions support a wide range of bonding applications
• Modular platform with customizable tooling and workholders
• Low placement force for fragile chips and sensitive devices
• Excellent repeatability for R&D and production environments
• User-friendly software requiring minimal operator training
• Cost-effective solution for precision die bonding, micro-placement, and advanced packaging applications